Micro Assembly Process Engineer

Duties: Lead troubleshooting and repair of complex probe cards and sub-assemblies. Perform probe card troubleshooting, repair and maintenance. Support Manufacturing Engineering activities by recognizing, prioritizing, and acting improvement opportunities, pioneering new ideas, and finding innovative methods to accomplish production goals. Coach and train technicians to develop teamwork, leadership, and technical skills. Perform operator Core trainer training and certification across CWW shifts. Participate in tests and experiments to improve production processes or develop new products and processes. Support modifications of automated assembly systems process, alignment measurement parameters, as well as create and modify procedures for new products. Support first article probe cards including mechanical substrate alignment and sub-assembly, associated new tooling introduction, initial set-up and verification, various metrology steps, and rework if necessary. Project manage and participate in assembly equipment hardware and sofware upgrades based on process quality and throughput objectives. Participate in equipment capacity increases, CapEx Projects, and product related tooling capacity increases to ensure FormFactor meets capacity demand. 

Education:

Required: Bachelor’s degree or foreign equivalent in Manufacturing Engineering, Mechanical Engineering or related field. 

Experience:

Required: 5 years of progressive experience as Field Service/Application Engineer, Quality Control Engineer, or related occupation. 

Special Requirements: Must have at least 1 year of work experience in each of the following:  

1. Managing medium-to-complex analysis models in JMP, including process data, yield analysis, implement quality controls and DOEs using statistical program software. 

2. Troubleshooting probe cards issues for all components. 

3. NPI (new product introduction) processes and equipment assessment and customization. 

4. Micro assembly process and equipment performance CPI (continuous process improvement) to lead improvement projects.  

5. Using microscopes, micromanipulators, and metrology tools. 

6. Troubleshooting and repairing precision electromechanical assemblies using root cause analysis techniques and standard measurement instruments. 

7. Transferring process from early stage of development to LVM (Low Volume Manufacturing) and HVM (High Volume Manufacturing). 

8. Dimensional inspection and alignment verification using metrology tools: optical measurement systems, calipers, micrometers, and dial indicators. 

9. Establishing HVM processes including documentation, requirements, specifications, and manufacturing work instructions. 

Salary: $147,248 to $152,248 per year 

Worksite: 7005 Southfront Road, Livermore, CA 94551